Generally use power or low power LED encapsulation, common electronic PCB board and comply with the industry, but with the question of the expansion of the market, meet the high power levels extending time arrival, PCB substrate gradually not use use ...
in LED industry promising prospects, everyone focus on high power LED in at this time, the development of high power, in addition to considering Taiwan industry itself, the structure of the high power chain of configuration and thermal radiation, thermal substrate and the background of the development of the technical evolution of cooling substrate.
High power LED (high power LED lights), only 20% light in energy input, the rest were consumed with hot form, if this heat can not timely, ejecte outside than LED life will be passed. So how is the heat LED expelled? LED by mostly by encapsulate mode and the thermal conductivity of the use of material influenced Hot Sanayi way is hot or conduction, convection and radiation these three types of packaging materials, and led the accumulation of heat energy, most of the scattered out with square geleidingdus packaging mode and material selection is a key.
Traditional packaging shells with plug-in type, used in household appliances communications products light indicator, often see the color is red, yellow, and green light etc, target because of most of the heat generated LED only by two wire, performed to the substrate meeting thermal ivity, cooling effect is not pretty.
The traditional Pcbs do not take the heat high power, continued the development on low-power LEDs, target thanks to the processing, investment, technology and other considerations, it will not be to high power LED production research direction in planning, while existing machine, or using other electronic substrate using technology transfer to the LEDs to costs (led bulbs), improve efficiency goal.
PCBs belong to low power LED encapsulation, and larger than 1W leds (Watts) with MCPCB mainly by million electron criterion for example, and no emphasis on the bottom plate, the type of purpose entirely based on demand of the market and product characteristics distinguished, with suitable material match the most appropriate of raw materials. Over million plywood production companies for commodities, the main hall of grain is stuck in Ceramic substrates by company right move products, a draft specification and the rest of the total 10%, 90% is in command of downstream vendors. Soft apartment with flexible can be applied to the special structure and thermal conductivity and MCPCB close, in small volume of application, types of variable-speed of goods. :Under the leadership of lamp
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